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Gigabyte AORUS NVMe Gen4 M.2 1000 GB PCI Express 4.0 3D TLC
$219.49
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Gigabyte AORUS NVMe Gen4 M.2 1000 GB PCI Express 4.0 3D TLC

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Product Description

Gigabyte AORUS NVMe Gen4 M.2 1000 GB PCI Express 4.0 3D TLC

World First PCIe 4.0x4 Controller The World First PCIe 4.0x4 Controller, Phison PS5016-E16 controller, made by 28nm manufacturing technology. The advanced fabrication process ensures PS5016-E16 has enough compute power for ECC processing when adopting the latest 3D TLC NAND flash. PS5016-E16 also features eight NAND channels with 32 CE targets, DDR4 DRAM caching, and a PCIe 4.0x4 interface. As for features, the chip supports the NVMe 1.3 protocol, LDPC error correction, and Wear Leveling, Over-Provision technologies to improve reliability and durability of SSDs. NAND Flash Selected for High Quality and Performance TOSHIBA BiCS4 96 Layers 3D TLC (800MT/s) Toshiba BiCS4 NAND Flash optimizes circuitry and architecture by increasing to 96 layers for higher storage space per unit area. 800MT/s throughput on the AORUS NVMe Gen 4 SSD far exceeds that of PCIe 3.0x4 devices for superior storage performance. Xtreme Storage Performance With the new PCIe 4.0 controller, AORUS NVMe Gen 4 SSD delivers blazing speeds: up to 5,000 MB/s for sequential read, and up to 4,400MB/s sequential write. Sequential Read performance of PCIe 4.0 SSDs is up to 40% faster than PCIe 3.0 SSDs. Get ready to enter the next generation of computing with faster and smoother, gaming, streaming, and graphics intensive rendering. Full Body Copper Thermal Solution for Outstanding PCIe 4.0 SSD Performance The Full Body Copper Heatsink takes into account the heat transfer from key components on both the front and back of the device, the controller and NAND Flash. Full copper heatsinks have 69% higher heat transfer capacity compared to aluminum heatsinks giving AORUS NVMe Gen4 SSD the best heat dissipation for read/write performance. Efficient Copper Heat Spreader Design Compared with a plated M.2 heat spreader, new efficient copper heat spreaders with 27 fins add more surface area which improve thermal transfer from heating sources to obtain thermal balance sooner. Moreover, Optimized fin array design does great heat exchange with any direction of air flow. Both unique design make sure key components of PCIe 4.0 SSD to keep suitable working temperature under ultra high transfer rate. Why is keeping an SSDs at lower temperatures so important? - Higher working temperature may cause data loss. The degradation factor of data loss could be a hundred times higher. - With Full Body Copper Heat Spreaders, the AORUS NVMe Gen 4 SSD can operate at lower working temperatures to improve data storage reliability. Furthermore, SSDs can deliver extreme performance for longer periods. SSD Tool Box The newly updated SSD Tool Box is a software that gives users an overview of the SSD Status and various aspects such as model name, FW version, health condition and sensor temperature. Moreover, users can clear all the data with the Secure Erase function. You can download the SSD Tool Box from the link.

Specifications

Hard drive

SSD capacity 1000 GB

Memory type 3D TLC

Data transmission

Read speed 5000 MB/s

Write speed 4400 MB/s

Random write (4KB) 700000 IOPS

Random read (4KB) 750000 IOPS

Endurance

Mean time between failures (MTBF) 1770000 h

Performance

Interface PCI Express 4.0

Component for PC/notebook

NVMe Yes

NVMe version 1.3

SSD capacity 1000 GB

S.M.A.R.T. support Yes

Read speed 5000 MB/s

TRIM support Yes

Write speed 4400 MB/s

Memory type 3D TLC

Random write (4KB) 700000 IOPS

Random read (4KB) 750000 IOPS

Mean time between failures (MTBF) 1770000 h

Design

Component for PC/notebook

SSD form factor M.2

Features

Interface PCI Express 4.0

Component for PC/notebook

NVMe Yes

NVMe version 1.3

SSD capacity 1000 GB

S.M.A.R.T. support Yes

Read speed 5000 MB/s

TRIM support Yes

Write speed 4400 MB/s

Memory type 3D TLC

Random write (4KB) 700000 IOPS

Random read (4KB) 750000 IOPS

Mean time between failures (MTBF) 1770000 h

SSD form factor M.2

Power

Power consumption (write) 6.6 W

Power consumption (read) 6.5 W

Operational conditions

Operating temperature (T-T) 0 - 70 °C

Storage temperature (T-T) -40 - 85 °C

Technical details

Interface PCI Express 4.0

S.M.A.R.T. support Yes

Operating temperature (T-T) 0 - 70 °C

TRIM support Yes

Storage temperature (T-T) -40 - 85 °C

SSD form factor M.2

Weight & dimensions

Package type Box

Width 80.5 mm

Height 11.4 mm

Depth 23.5 mm

Packaging data

Manual Yes

Package type Box

Packaging content

Manual Yes

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